Rapid thermal annealing of semiconductor wafers (RTA / RTP)
Jipelec Jetfirst100 is a rapid thermal annealing (RTA) system that can be used for thermal processing such as increasing/decreasing defects in crystalline materials, inducing phase changes etc.
Reactive plasma etcher with chlorine chemistry (ICP-RIE)
ICP Plasmalab 100 (Oxford Plasma Technology) is a ICP-RIE system (Inductively Coupled Plasma – Reactive-Ion Etching) used mainly for semiconductor dry etches using various soft and hard masks. There is also a separate RIE unit, but the advantage of ICP…
Reactive plasma etcher with fluorine chemistry (RIE)
RIE Plasmalab 100 (Oxford Plasma Technology) is a RIE system (Reactive-Ion Etching) mainly used for dielectric and polymer dry etching using various soft and hard masks. There is also a separate (ICP-RIE) unit for processes where improved control of the…
Reactive plasma etcher with fluorine chemistry (RIE)
Advanced Vacuum Vision 320 RIE is a reactive ion etching device. Typical use cases are dry etching of thin films like SiN and SiO2 or oxygen plasma treatments to clean the substrates or to change the surface properties like hydrophilicity…
Semi automatic wire bonder (Ball-wedge)
West-Bond Model 454647E wire bonder is a semiautomatic system for making reproducible wire bonds with gold wire. System drives for both Y and Z axes bond a succession of parallel, single or multiple arched wires maintaining an identical loop and…
Shear and pull tester for chips and wires
Dage4000 Bondtester is a system for testing chip-to-chip and wire-to-chip bonds.
SiO2 and SiN deposition using plasma enhanced CVD (PECVD)
Two Plasmalab 80+ Plasma Enhanced Chemical Vapor Deposition systems (PECVDs) (Oxford Plasma Technology, 2000) are used for thin film growths and plasma treatments. Normal process temperature is 300 °C and the operatable range is from room temperature to 400 °C.…