Dage4000 Bondtester is a system for testing chip-to-chip and wire-to-chip bonds.
Details
Location:
Tampere University (TAU), Tampere
Contact person:
Jukka Viheriälä (Tampere)
Info:
ystem Description
Dage4000 Bondtester is a system for testing chip-to-chip and wire-to-chip bonds. The system has measurement cartridges for different purposes.
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Shear test cartridge is used for measuring the shearing force that is needed to break a bond between two chips or for example a wire ball bond on top of a chip.
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Pull test cartridge is used for measuring the pulling force needed to break a wirebond.
The tools software records the measurement results and assists in the analysis. In addition, the operator is required to input the type of breakage that was observed. For the observation the tool has a microscope that can be used also during the test to see the live action. The tool adds the type of the breakage into the data.
The samples are attached to a vice so that they are not displaced by the testing head. Nominally the samples should be about 20 mm wide for clamping but with help of a piece of laboratory glass even a few mm samples can be clamped.
Training Requirements
Relatively easy to use, can be trained even for a single set of measurements.
Not allowed processes
Testing of sticky or other materials which could contaminate the test head.
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