Advanced Vacuum Vision 320 RIE is a reactive ion etching device. Typical use cases are dry etching of thin films like SiN and SiO2 or oxygen plasma treatments to clean the substrates or to change the surface properties like hydrophilicity prior applying some thin film or bonding.
Details
Location:
Tampere University (TAU), Tampere
Contact person:
Jukka Viheriälä (Tampere)
Info:
Advanced Vacuum Vision 320 RIE is a reactive ion etching device. Typical use cases are dry etching of thin films like SiN and SiO2 or oxygen plasma treatments to clean the substrates or to change the surface properties like hydrophilicity prior applying some thin film or bonding.
Specifications
Gases: Ar, CF4, CHF3, O2, SF6
Typical substrates: Glass or silicon wafers
Max sample size: 12″
RF-generator: 600 W, 13.56 MHz
Cooling: Water-cooled substrate table
Load lock: No
Etch depth measurement system: Optical
Not allowed processes
At least so far there has been no material limitations (e.g., PDMS is allowed), which is good to acknowledge if one is afraid of contamination.
Training Requirements
Basic training available with low threshold.
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