Semi automatic wire bonder (Ball-wedge)

West-Bond Model 454647E wire bonder is a semiautomatic system for making reproducible wire bonds with gold wire. System drives for both Y and Z axes bond a succession of parallel, single or multiple arched wires maintaining an identical loop and bond shapes that can be stored to a recipe. Bonding is achieved with ball-wedge bond strategy where the first bond is with a ball connection and the second with a wedge. The first bond can be aimed with crosshair and camera view but the second bond is always manually positioned (or at fixed distance from first bond). Besides wire bonding equipment can be used for bumbing.

Specifications

This tool is not for fine pitch wire bonding. It is possible to bond on pad roughly 100×100 µm^2 in size depending on operator skill. Pitch > 200 µm is possible (but not always easy).

Wire Materials: 25  µm Au-wire

Typical substrates: Require wire bond compatible metallization for example Au or ENIPIG. Wire bonding is typically done at 150degC so substrate should withstand this. Lower bonding temperature is also an option but something that has to be discussed with contact persons.

Typical applications: Wire connections from semiconductor chip to assembly or package level.

About editing parameters

Its possible to make new recipes but those should be marked into recipe log found below. Only owner of recipe (or main users) can edit recipe. Values in recipe log are the official values for each recipe. If paramters on machine are different to log ones on log are correct.

Training Requirements

For a user to get training for the wire bonder, they have to have:

• Frequent need in scale of at least once per few months

If these requirements aren’t fulfilled, it is possible to get few wire bond batches done by the responsible operator.

Not allowed processes

Bonding pads other than Au or ENIPIG

Bonding on soft substrates (plastics for example) or on substrates that start to decompose at 150 degC temperature.