

Integration Flip-chip and die bonding
Die bonding and pick-and-place assembly
Bonding of dies and chips on both planar and flexible substrates (excluding sub-micron flip-chip)
Integration Flip-chip and die bonding
Flip-chip bonding with sub-micrometer accuracy
Most demanding flip-integration with sub-micron accuracy is needed for e.g. waveguide-waveguide coupling
Integration Flip-chip and die bonding
High precision automatic wire bonder (Ball-wedge, wedge-wedge, ribbon, stud bump)
K&S Maxµm Ultra Automatic Ball Bonder is an automatic system for making reproducible wire bonds with gold wire.
Integration Flip-chip and die bonding