Integration Flip-chip and die bonding
Die bonding and pick-and-place assembly
Bonding of dies and chips on both planar and flexible substrates (excluding sub-micron flip-chip)
Integration Optical module packaging , Waveguide and fiber alignment
Fiber alignment and pigtailing
Fiber-waveguide alignment and permanent fiber pigtailing for photonic chips and modules
Integration Waveguide and fiber alignment
Fiber splicing
Permanently connecting fibers and fiber arrays together
Integration Flip-chip and die bonding
Flip-chip bonding with sub-micrometer accuracy
Most demanding flip-integration with sub-micron accuracy is needed for e.g. waveguide-waveguide coupling
Integration Optical module packaging