Precision assembly cell for mico- and fiber-optics

System Description

CustomLine CL1500 is the standalone assembly cell intended for active assembly tasks involving fibers or lenses. CustomLine systems are ficonTEC’s most adaptable and versatile multi-purpose micro-assembly machines, providing fully automated align-&-attach for integrating optoelectronic and photonic devices. This product line sees exceptionally diverse usage within R&D, process development, and manufacturing. The CL1500 assembly station has diverse technical vision capabilities, precise 4- and 6-axis micromanipulators, adhesive dispenser and UV-cure unit and many other units, required in assembly and test processes. In 2022-2025 it was complemented by a through-silicon microscope and laser-assisted bonding unit to ensure flip-chip bonding processes with negligible temperature-induced stress and warpage.

Specifications

This tool is a complex system, containing lots of units and moving parts. The key parameters are briefly listed in Technical Machine Document.

Typical substrates: The Cl1500 works fine with metal, ceramic, silicon, glass and other materials, typically used in various assembly processes. The requirements and dimensions should be negotiated with responsible operator individually for each assembly process. 

Typical applications: Microassemblies using adhesive bonding, active and passive alignment, optical interfacing (fiber pigtailing + free space lens attach), laser-assisted flip-chip bonding.

About editing parameters
The CL1500 assembly station supports various complex assembly recipes, as it is highly reconfigurable tool with flexible software interface.

NOTE: each assembly process requires hardware reconfiguration and recipe design and MUST NOT be implemented without consultation with responsible operator.

Training Requirements

For a user to get training for the assembly station, they have to have a frequent need in scale of at least once per few months.

In any case, the process development and hardware reconfiguration should be done together with responsible operator, after familiarising with Technical Machine Document, PCM Training Materials and 2 software guides: Software Guide 1 and Software Guide 2.

Laser-Assisted Bonding processes are available ONLY after familiarising with Laser Setup Datasheet and Manual, and further discussion with responsible operator. Detailed description of Through-Silicon Microscopy and Laser-Assisted Bonding setups, using custom Sample Holder, are provided by corresponding links.

Not allowed processes

No process should be initiated without discussion with responsible operator.