Module-level packaging and sealing for photonic components
FinnLight has extensive know-how and experience in the module-level packaging of photonic components. This includes the assembly of the parts into a package or on a suitable assembly platform. Electrical wiring can be done to connect the components to each other and to external ports. Sealing and encapsulation processes include hermetic and vacuum sealing. For high-precision flip-chip bonding, die bonding and fiber pigtailing, refer to dedicated service pages.
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