Loomis LSD-100 scriber is a system for wafer dicing.
Details
Location:
Tampere University (TAU), Tampere
Contact person:
Jukka Viheriälä (Tampere)
Info:
System Description
Loomis LSD-100 scriber is a system for wafer dicing. The system uses a diamond tool for scribing. Break mechanism consists of a break mandrel and a break wheel. The break mandrel supports the wafer at the scribe line. Breaking occurs when the break wheel rolls over the wafer and applies a bending force to the wafer along the scribe line.
The system can be run in manual or automatic mode easily switching between them.
Specifications
Wafer size: up to 4”
Die size: from centimeters to ~ 200 µm x 200 µm (for best yield the die size should be at least twice the thickness of the wafer material)
Typical scribe positioning accuracy: +/- 5 µm
Typical substrates: GaAs, GaSb, InP
Training Requirements
For a user, to get training for the scriber, must have frequent need for dicing.
If this requirement isn’t fulfilled, it is possible to get service type work from responsible operators.
Not allowed processes
Currently the system is dedicated to III/IV semiconductor dicing only. Dicing other materials (Si, glass etc.) is not allowed.
Other material:
User guide
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