High precision automatic wire bonder (Ball-wedge, wedge-wedge, ribbon, stud bump)

System Description

K&S Maxµm Ultra Automatic Ball Bonder is an automatic system for making reproducible wire bonds with gold wire. System drives for both Y and Z axes bond a succession of parallel, single or multiple arched wires maintaining identical loop and bond shapes that can be stored to a recipe. Bonding is achieved with ball-wedge bond strategy where first bond is with ball connection and second with wedge. The system can be driven in automated and semiautomated modes which are controlled by machine vision software. Automatic mode allows extremely fast and reproducible wiring for a variety of components. ​​​​​​​

Specifications

Effective minimum Pitch is around 100 µm, but requires skill and additional considerations.

Wire Materials: 25  µm Au-wire

Typical substrates: Require wire bond compatible metallization for example Au or ENIPIG. Wire bonding is typically done at 150degC so substrate should withstand this. Lower bonding temperature is also an option but the bonding parameters should be optimized.

Typical applications: Wire connections from semiconductor chip to assembly or package level.

Training Requirements

For a user to get training for the wire bonder, they have to have:

• Frequent need in scale of at least once per few months

If these requirements aren’t fulfilled, it is possible to get few wire bond batches done by the responsible operator.

Not allowed processes

Bonding pads other than Au or ENIPIG

Bonding on soft substrates (plastics for example) or on substrates that start to decompose at 150 degC temperature.

​​​​​​​Other materials :

Additional information available in S:\61501_Common\Equipment\Cleanroom – 2nd floor – Packaging Lab (SK215)\K&S Wirebonder