Integration Flip-chip and die bonding
Die bonding and pick-and-place assembly
Bonding of dies and chips on both planar and flexible substrates (excluding sub-micron flip-chip)
Integration Optical module packaging , Waveguide and fiber alignment
Fiber alignment and pigtailing
Fiber-waveguide alignment and permanent fiber pigtailing for photonic chips and modules
Integration Waveguide and fiber alignment
Fiber splicing
Permanently connecting fibers and fiber arrays together
Integration Flip-chip and die bonding
Flip-chip bonding with sub-micrometer accuracy
Most demanding flip-integration with sub-micron accuracy is needed for e.g. waveguide-waveguide coupling
Integration Flip-chip and die bonding
High precision automatic wire bonder (Ball-wedge, wedge-wedge, ribbon, stud bump)
K&S Maxµm Ultra Automatic Ball Bonder is an automatic system for making reproducible wire bonds with gold wire.
Integration Optical module packaging
Photonics module packaging and sealing
Module-level packaging and sealing for photonic components
Integration Flip-chip and die bonding
Precise wafer dicing using scribe and break method
Loomis LSD-100 scriber is a system for wafer dicing.
Integration Optical module packaging
Precision assembly cell for mico- and fiber-optics
CustomLine CL1500 is the standalone assembly cell intended for active assembly tasks involving fibers or lenses.
Integration Flip-chip and die bonding