Fabrication Material processing
Photonic glasses
We host various tools for fabrication of photonic glass materials.
Fabrication Material processing
Precise diamond saw for wafer dicing and other applications
Disco Automatic dicing saw model DAD3221 and connected to DTU162 water temperature control unit.
Fabrication Material processing
Rapid thermal annealing of semiconductor wafers (RTA / RTP)
Jipelec Jetfirst100 is a rapid thermal annealing (RTA) system that can be used for thermal processing such as increasing/decreasing defects in crystalline materials, inducing phase changes etc.
Fabrication Micro- and Nanopatterning
Reactive plasma etcher with chlorine chemistry (ICP-RIE)
ICP Plasmalab 100 (Oxford Plasma Technology) is a ICP-RIE system (Inductively Coupled Plasma – Reactive-Ion Etching) used mainly for semiconductor dry etches using various soft and hard masks. There is also a separate RIE unit, but the advantage of ICP…
Fabrication Micro- and Nanopatterning
Reactive plasma etcher with fluorine chemistry (RIE)
RIE Plasmalab 100 (Oxford Plasma Technology) is a RIE system (Reactive-Ion Etching) mainly used for dielectric and polymer dry etching using various soft and hard masks. There is also a separate (ICP-RIE) unit for processes where improved control of the…
Fabrication Micro- and Nanopatterning
Reactive plasma etcher with fluorine chemistry (RIE)
Advanced Vacuum Vision 320 RIE is a reactive ion etching device. Typical use cases are dry etching of thin films like SiN and SiO2 or oxygen plasma treatments to clean the substrates or to change the surface properties like hydrophilicity…
Fabrication Material processing
SiO2 and SiN deposition using plasma enhanced CVD (PECVD)
Two Plasmalab 80+ Plasma Enhanced Chemical Vapor Deposition systems (PECVDs) (Oxford Plasma Technology, 2000) are used for thin film growths and plasma treatments. Normal process temperature is 300 °C and the operatable range is from room temperature to 400 °C.…
Fabrication Micro- and Nanopatterning
Substrate thinning and polishing system
Logitech PM5 precision lapping&polishing machine is a system for semiconductor wafer backside thinning.
Fabrication Material processing
