Substrate thinning and polishing system

System Description

Logitech PM5 precision lapping&polishing machine is a system for semiconductor wafer backside thinning. The machine is equipped with plate flatness control and is compatible with Chemlox.

Lapping is done on a glass or cast iron lapping plate, typically with aluminum oxide slurry, and polishing on a polishing cloth with special polishing fluids. Wafer is glued onto a glass carrier with wax. The carrier with the wafer is attached to a jig with vacuum and placed on the rotating lapping/polishing plate for lapping/polishing.

Specifications

Typical substrates: GaAs, GaSb, InP, Si, photonic glasses (photonic glasses must be processed with a jig and plates dedicated for photonic glasses)

Wafer size: up to 3”

Training Requirements

For a user, to get training for the lapping&polishing machine, must have frequent need for lapping&polishing.

If this requirement isn’t fulfilled, it is possible to get service type work from responsible operators.

Processes Not allowed

All processes that might cause cross contamination to the typical substrates. Always ask the responsible person if you would like to process materials not on the list of typical substrates.

​​​​​​​Other material:

User guide