Die bonding and pick-and-place assembly
Bonding of dies and chips on both planar and flexible substrates (excluding sub-micron flip-chip)
Diffractometry and scatterometry
Charaterization of surfaces based on the diffraction or scattering of light from the surface.
Fiber alignment and pigtailing
Fiber-waveguide alignment and permanent fiber pigtailing for photonic chips and modules
Fiber splicing
Permanently connecting fibers and fiber arrays together
Flip-chip bonding with sub-micrometer accuracy
Most demanding flip-integration with sub-micron accuracy is needed for e.g. waveguide-waveguide coupling
Frequency and linewidth characterization
Understanding the laser beam properties is essential for many applications.
Machine vision & co-ordinate measuring machines
Different machine vision tools and co-ordinate measuring machines (CMM) are useful e.g. in photonics assembly quality control.