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Reactive plasma etcher with fluorine chemistry (RIE)

RIE Plasmalab 100 (Oxford Plasma Technology) is a RIE system (Reactive-Ion Etching) mainly used for dielectric and polymer dry etching using various soft and hard masks. There is also a separate (ICP-RIE) unit for processes where improved control of the…

Reactive plasma etcher with fluorine chemistry (RIE)

Advanced Vacuum Vision 320 RIE is a reactive ion etching device. Typical use cases are dry etching of thin films like SiN and SiO2 or oxygen plasma treatments to clean the substrates or to change the surface properties like hydrophilicity…