Siirry sisältöön

Reactive plasma etcher with chlorine chemistry (ICP-RIE)

ICP Plasmalab 100 (Oxford Plasma Technology) is a ICP-RIE system (Inductively Coupled Plasma – Reactive-Ion Etching) used mainly for semiconductor dry etches using various soft and hard masks. There is also a separate RIE unit, but the advantage of ICP…

Reactive plasma etcher with fluorine chemistry (RIE)

RIE Plasmalab 100 (Oxford Plasma Technology) is a RIE system (Reactive-Ion Etching) mainly used for dielectric and polymer dry etching using various soft and hard masks. There is also a separate (ICP-RIE) unit for processes where improved control of the…