Bonding of dies and chips on both planar and flexible substrates (excluding sub-micron flip-chip)
Details
Location:
VTT, Espoo, Oulu, Tampere
Info:
Photonic, electronic and/or microfluidic dies (or chips) can be bonded together into multi-chip modules and other photonic assemblies. The underlying substrate can be a chip, a wafer, a printed circuit board or even a large roll-to-roll (R2R) foil. Die bonding is typically faster and less accurate than flip-chip bonding (see separate service card).
Die bonding at VTT in Oulu
Multichip Die Bonder, Datacon (Besi) EVO 2200, is a versatile and automated die attach tool that supports high-volume assembly. It has R2R capability and a bio dispenser. Contact person is Markku Lahti.
Die bonding at VTT in Espoo
Infotech die sorting machine in Micronova allows to pick-and-place dies and chips with high throughput. There is also a camera system to automatically image large areas.
FC 150 bonding tool in Micronova is an older flip-chip bonding tool that is not suitable for sub-micron flip-chip bonding, but it can be used for manual and semi-automated die bonding and flip-chip bonding with approximately 1 µm accuracy.
Contact person for both tools and related services is Giovanni Delrosso.
Die bonding at TAU in Tampere
System Description
Ficontec BL2000 Flip-chip bonder is a system for automatic C2C bonding. The chips can be joint with either In or AuSn pre-deposited solder. The typical application is laser chip bonding onto submounts.
Placement accuracy +/- 10 µm
Chip transfer by bonding arm. Changeable tool for different chip sizes. Chip are picked up and ready components returned to Gel-paks.
Flip-chip module for flipping the chips.
Camera system with Top camera mounted on the arm and Bottom camera on the table.
Distance sensors for mapping chip and substrate surfaces in order to co-planarize them.
Pattern recognition for the chip placement
Formier as the process gas
Max process temperature 400 °C
Specifications
Effective minimum chip dimensions are 0.4 mm x 0.5 mm for handling. For substrates 2 x 5 mm due to the heating oven’s vacuum holes.
Solder Materials: AuSn and In, needs to be pre-deposited on the substrates or chips.
Typical substrates: AlN submounts
Typical applications: Flip-chip bonding of laser chips onto a submount.
Training Requirements
Operating the tool requires extensive understanding of the hardware and the software. Only the responsible users can operate it.
Not allowed processes
Bonding of soft substrates or chips (plastics for example) or on substrates that start to decompose at 200 °C (In bonding) or 350 °C (AuSn bonding)
Other material:
Additional information available in S:\61501_Common\Equipment\Cleanroom – 2nd floor – Packaging Lab (SK215)\ficonTEC-BL2000-automatic-die-bonder
Contact person for both tools and related services is Jukka Viheriälä
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