Precise diamond saw for wafer dicing and other applications

System Description

Disco Automatic dicing saw model DAD3221 and connected to DTU162 water temperature control unit

• 2.000W synchro spindle, speed range 3.000 – 40.000min-1

• 6” porous chuck table for 6” frames

• X-axis:

  • Cutting range: 160 mm

  • Operating Speed: Transfer speed 0.1 – 800 mm/s

• Y-axis:

  • Cutting range: 162 mm

  • Positioning accuracy: 0.005 mm or less/160 mm

  • Feed speed: 200 mm/s

• Z-axis:

  • Max sample thickness depends on blade exposure.

  • Moving speed: 80 mm/s

  • Z-position repeatability: 0.001µm

• ϑ-axis:

  • Motor resolution: 0.08”

Additional features

• Blade breakage detector

• Automatic focus

• Pattern recognition system for automatic dicing. User just loads and unloads the sample.

  • Alignment patterns needs teaching and testing

Training Requirements

Basic training available with low threshold.

​​​​​​​Material:

Available blades: TBA

Typical materials used

• 1-2 mm glass

• 525 µm silicon

Low cut speed materials:

• LiNbO wafers

• Sapphire glass wafer

If new ones needed, user can request new blades from the manufacturer