FinnLight https://validator.w3.org/feed/docs/rss2.html Wide-Bandwidth sampling Oscilloscope, Agilent (Keysight) DCA-X 86100D News Home About Finnlight Scanning Probe Microscopy Optical surface profilometry Mechanical surface profilometry Machine vision & co-ordinate measuring machines Frequency and linewidth characterization Diffractometry and scatterometry Flip-chip bonding with sub-micrometer accuracy Die bonding and pick-and-place assembly Characterization of waveguide components Wafer-level testing Antti Brunström Solar cell characterization SiO2 and SiN deposition using plasma enhanced CVD (PECVD) Spectroscopic material characterization Time-resolved spectroscopy characterization Inverted microscope with imaging spectrophotometer High speed camera Fourier Transform Optical Spectral Analyzer (FT-OSA) Fluorescence lifetime imaging microscope Langmuir-Blodgett film deposition system with Brewster angle microscope Essi Sariola-Leikas Precise diamond saw for wafer dicing and other applications Reactive plasma etcher with fluorine chemistry (RIE) Atomic layer deposition Substrate thinning and polishing system Shear and pull tester for chips and wires Precision assembly cell for mico- and fiber-optics Precise wafer dicing using scribe and break method High precision automatic wire bonder (Ball-wedge, wedge-wedge, ribbon, stud bump) Rapid thermal annealing of semiconductor wafers (RTA / RTP) Reactive plasma etcher with chlorine chemistry (ICP-RIE) Reactive plasma etcher with fluorine chemistry (RIE) Electron beam lithography equipment Direct writing lithography system Semi automatic wire bonder (Ball-wedge) Laser pulse length measurements Gsolver optics software Metricon Anritsu pulse pattern generator Keysight sampling oscilloscope Anritsu Vector network analyzer Advantest Bit error rate tester Beam Analyzer with M2, Thorlabs Bit-error-rate tester, 4 channels, Multilane ML4039 Cookie Statement Surface plasma treatment system