Ultra-precise die and flip-chip bonder

SET ACCµRA Plus (SET, 2024) is very versatile and accurate to different type of scenarios to bond or stack chips on different type of chip carriers, interposers and substrates. Bonding is possible with solder, metal-metal interface, glue and sintering process. Some highlights:

• 0.5 µm 3 sigma chip bonding accuracy
• Thermocompression bonding up to 450degC and ultrasonic bonding
• Sintering processes to up to 100 bar limited by 1000N
• Tool is configured to C2C processing but upgradable to C2W up to 200mm diam. wafers
• Time-pressure fluid dispenser and dip-tray to apply adhesives (and UV-curing lamps for UV-adhesives)
• Automatic die-ejector system for up to 200 mm wafers and chip-flip module. Die presentation with 2” and 4” chip trays.
• Chip sizes from ~0.2×0.2 mm2 range to 50×50 mm2 range
• Automatic mode for up to ~120 chips per hour range

• Cognex-based optical pattern recognition for chip and substrate alignment.

Functionalities

System contains two robots. A highly precise bonding robot handles the chip alignment and bonding, and less precise transfer robot handles feeding the parts for the bonding robot.