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Characterization Optical component characterization

Thermal characterization of components

Thermal image of a control board inside a tunable laser.

Services and tools to test the thermal characteristics of photonic components


Location: VTT, Espoo, Oulu
Contact persons: Markku Alamäki (Oulu), Ben Wälchli (Espoo)
Wavelength: SWIR (1.2 µm - 2.5 µm), MWIR (2.5 µm - 7 µm), LWIR (7 µm - 20 µm)

Thermal resistance measurements with Simcenter T3STER (in Oulu)

Contact person: Markku Alamäki at VTT

Advanced non-destructive transient thermal tester for thermal characterization of packaged semiconductor devices (diodes, BJTs, power MOSFETs, IGBTs, power LEDs) and multi-die devices, capable of testing components in situ.Thermal

Thermal camera imaging (in Espoo)

Contact person: Ben Wälchli at VTT

Thermal cameras can be used to analyze and image heat distribution in photonic components. Depending on required resolution and speed, different imagers can be used:

  • Fluke Ti 32
  • FLIR A6700
  • Cedip Titanium 560M (located in Kuopio)

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