Most demanding flip-integration with sub-micron accuracy is needed for e.g. waveguide-waveguide coupling
FinnLight consortium has the tools and experience for the most demanding flip-chip bonding tasks. For example, semiconductor optical amplifier (SOA) waveguide chips can be bonded up-side-down on silicon-on-insulator (SOI) waveguide chips to realize external cavity lasers. Because of the small mode-field diameters in the waveguides (<3 µm) the optical axes of the waveguides have to be aligned with sub-micron precision. Vertical alignment is typically done passively with mechanical standoff structures, while the horizontal alignment is achieved with high-resolution cameras that align the chips with respect to each other before the bonding.
High-precision flip-chip bonding at VTT in Espoo
New Finetech FEMTO2 flip-chip bonder was installed into Micronova clean room in 2023 and it will be used for the most demanding flip-chip bonding tasks, such as III-V compound semiconductor chip bonding on SOI waveguide chips and wafers. Nominal placement accuracy of the tool is 0.3 µm (3 sigma). This tool supports fully automated chip-to-wafer bonding, as well as chip-to-chip bonding.
High-precision flip-chip bonding at VTT in Oulu
Finetech FINEPLACER® sigma flip-chip bonder can be used for the most demanding flip-chip bonding tasks. This tool enables manual and semi-automated chip-to-chip bonding with a nominal placement accuracy of 0.5 µm.
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