Siirry sisältöön
Fabrication Micro- and Nanopatterning

Electron Beam Lithography, EBL

We offer the entire fabrication chain or a portion, such as e-beam patterning, according to the customer’s design.


Location: University of Eastern Finland (UEF), Joensuu
Contact persons: Petri Karvinen (Joensuu), Pertti Pääkkönen (Joensuu)


We use electron beam writing and various complementary lithographic techniques in our clean room fabrication process. We can fabricate functional devices, etch masks, or master elements for replication. Fabricated master elements can be silicon or oxides, or alternatively, Ni shims grown by electroplating.  Applications include optical, tactile, tailored, and functional surfaces using micrometer and nanometer scale features.

Routinely processed elemental layer materials include silicon, SiO2, TiO2, Al2O3, Si3N4, aluminum, and gold.

Our equipment includes:

  • Raith EBPG5000+ES electron beam writer
  • Kurt J. Lesker LAB18 Physical Vapour Deposition system with ebeam source and DC sputtering
  • Moorfield Minilab 026 Physical Vapour Deposition system with thermal source and AC sputtering
  • Quorum Q300T sputter coater
  • Beneq TFS-200 Atomic Layer Deposition system
  • Oxford Instruments Plasmalab 100 RIE/ICP etching system
  • Oxford Instruments Plasmalab 80 RIE/ICP etching system
  • Obducat EITRE-3 Nanoimprint lithography system
  • Jenoptik EFNI-01 Nickel electroplater

Our methods include:

  • Electron beam lithography
  • Thin film deposition
  • Evaporation
  • Sputtering
  • Atomic Layer Deposition (ALD)
  • Etching
    • Reactive ion etching (RIE)
    • Wet etching
  • Replication
    • Nanoimprint lithography (NIL)
    • Hot embossing
    • Roll-to-roll imprinting
    • Nickel electroplating

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