Die and flip-chip bonder for thin solder / high power applications

System Description

Ficontec BL2000 Flip-chip bonder is a system for automatic C2C bonding. The chips can be joint with either In or AuSn pre-deposited solder. The typical application is laser chip bonding onto submounts.

• Placement accuracy +/- 10 µm

• Chip transfer by bonding arm. Changeable tool for different chip sizes. Chip are picked up and ready components returned to Gel-paks.

• Flip-chip module for flipping the chips.

• Camera system with Top camera mounted on the arm and Bottom camera on the table.

• Distance sensors for mapping chip and substrate surfaces in order to co-planarize them.

• Pattern recognition for the chip placement

• Formier as the process gas

• Max process temperature 400 °C

Specifications

Effective minimum chip dimensions are 0.4 mm x 0.5 mm for handling. For substrates 2 x 5 mm due to the heating oven’s vacuum holes.

Solder Materials: AuSn and In, needs to be pre-deposited on the substrates or chips.

Typical substrates: AlN submounts

Typical applications: Flip-chip bonding of laser chips onto a submount.

Training Requirements

Operating the tool requires extensive understanding of the hardware and the software. Only the responsible users can operate it.

Not allowed processes

Bonding of soft substrates or chips (plastics for example) or on substrates that start to decompose at 200 °C (In bonding) or 350 °C (AuSn bonding)

​​​​​​​Other material:

Additional information available in S:\61501_Common\Equipment\Cleanroom – 2nd floor – Packaging Lab (SK215)\ficonTEC-BL2000-automatic-die-bonder